A private laboratory specialized in the analysis, testing and failure analysis of materials since 1993

Finding a defect on a chip card and its components can be very long and difficult due to the size of the various existing electronic components. The occurrence of a fault even within a component can make its characterization difficult because of its size and the ability to disassemble it. Industrialists must be able to carry out the investigations required to solve the problem in order to understand the origin of the short circuit.

Our facilities allow us to locate the fault using destructive or non-destructive methods.

The observations and characterizations we perform allow us to:

Precisely locate the fault (even within an electronic component) by determining the shape and dimensions;

• To analyze the surface or cross-sectional defect by optical and electron microscopy, to perform elemental analysis to identify the cause of the failure.

Application example :

Analysis of a defect within a thermistor
Highlighting the defect by X-ray microtomography

Localisation du corps étranger au niveau de la thermistance
Plan d observation

Characterization of the defect by elemental analysis

Cliché du plan d observation par microscopie électronique
Observation du corps étranger
Analyse élémentaire pour identification

Examples of associated technical facilities :

X-Rays Microtomography

Principle The X-beam passes through the sample, and is then collected by a detector. The X-ray (...)

For more details

Optical Microscope

Operating principle: 360-degree view of samples, without touching or moving them, Recording (...)

For more details

Scanning Electron Microscopy & EDS Microanalysis

This equipment can quickly provide information on the morphology and elemental composition of a (...)

For more details


To complete our installed base of equipment in terms of surface characterization, the (...)

For more details

For more information, contact us directly to exchange technically on your project !